Used BESI Fico MMS-X Molding Machine – 180 Ton Clamp Force (Built 2023)

Manufacturer Information

• Manufacturer: BESI (BE Semiconductor Industries)

• Model: Fico MMS-X

• Machine Type: Transfer Molding Machine

• Year Built: 2023

• Electrical: 3 Phase / 50–60 Hz / 208–480 Volt

Description

This used BESI Fico MMS-X molding machine is a high-precision transfer molding system engineered for advanced semiconductor and microelectronics packaging applications. With a maximum clamp force of 180 tons, the MMS-X platform delivers consistent mold pressure, uniform cavity temperature control, and high repeatability for demanding production environments.

Designed to support a wide range of strip sizes and pellet configurations, this system accommodates up to 12 plungers, multiple pellet diameters, and precise thermal control with a maximum cavity temperature variation of ±2°C. Built in 2023, this machine represents a modern, production-ready solution for high-reliability molding processes.

Specifications

• Manufacturer: BESI

• Model: Fico MMS-X

• Type: Transfer molding machine

• Year of Manufacture: 2023

Clamping & Mold Parameters

• Maximum Clamp Force: 180 tons

• Maximum Mold Opening: 150 mm

• Maximum Transfer Pressure: 150 bar

Strip & Pellet Handling

• Maximum Strip Size: 125 mm x 300 mm x 10 mm

• Pellet Diameters Supported: 14 mm, 14.3 mm, 16 mm, 18 mm

• Maximum Number of Plungers: 12

Thermal Performance

• Maximum Cavity Temperature Difference: ±2°C

Electrical

• Power Supply: 3 Phase / 50–60 Hz / 208–480V

Applications

• Semiconductor transfer molding

• IC and package encapsulation

• Power device molding

• Automotive electronics packaging

• Advanced microelectronics manufacturing

• High-reliability component production

What Might This Be Used For

• Encapsulation of semiconductor devices

• Transfer molding of IC packages

• Precision molding for power modules

• High-volume electronic component packaging

• Tight-tolerance molding processes

• Modern semiconductor assembly lines

Products This Machine Is Commonly Used For

• Integrated circuits (ICs)

• Power semiconductors

• Automotive electronic modules

• MEMS packages

• Discrete semiconductor devices

• High-reliability electronic components

• Industrial electronics

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