Used Kulicke & Soffa Asterion Wedge Bonding Machine – Advanced Precision (Built 2023)

Manufacturer Information

• Manufacturer: Kulicke & Soffa (K&S)

• Model: Asterion

• Machine Type: Wedge Bonding Machine

• Year Built: 2023

• Electrical: 1 Phase / 50–60 Hz / 200–240 Volt

Description

This used Kulicke & Soffa Asterion wedge bonding machine is a high-precision, next-generation wire bonding platform engineered for advanced semiconductor, microelectronics, and hybrid assembly applications. Featuring a large 300 mm x 300 mm bondable area, ultra-fine motion resolution, and sophisticated vision alignment, the Asterion delivers exceptional placement accuracy and repeatability.

The machine is equipped with sub-micron axis resolution, a wide-range theta axis, and the GS4 Pattern Recognition vision system, supporting complex bonding geometries and automated alignment. With a spacious material handler bay and modern control architecture, this 2023-built system is ideal for high-value production, R&D, and advanced packaging environments.

Specifications

• Manufacturer: Kulicke & Soffa

• Model: Asterion

• Type: Wedge Bonding Machine

• Year of Manufacture: 2023

Bonding & Motion Performance

• Bondable Area: 300 mm x 300 mm

• X & Y Axis Resolution: 0.1 µm

• Z Axis Resolution: 0.1 µm

• Z Stroke: 50 mm

• Theta Axis Range: ±220°

• Theta Axis Resolution: 0.0057°

Material Handling

• Material Handler Bay Size (without insert): 710 mm D x 225 mm H

• Open Bay Size: 710 mm D x 460 mm H

Vision System

• Vision: GS4 Pattern Recognition System

Electrical

• Power: 1 Phase / 50–60 Hz / 200–240V

Applications

• Semiconductor wire bonding

• Microelectronics assembly

• Power device packaging

• Hybrid circuit manufacturing

• Advanced IC packaging

• R&D and pilot production

What Might This Be Used For

• High-precision wedge wire bonding

• Fine-pitch interconnect applications

• Advanced semiconductor packaging

• Prototyping and development work

• Production of high-reliability electronic assemblies

• Automated bonding with vision-guided alignment

Products This Machine Is Commonly Used For

• Semiconductor devices

• Power modules

• MEMS components

• Hybrid circuits

• Sensors

• RF devices

• Automotive electronics

• Aerospace electronics

• Medical electronic devices

• High-density electronic assemblies

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